SMD Integrated Circuits & MCU Modules
Automotive-grade and industrial MCU, power-management and interface ICs in SOP, QFN, QFP and BGA packages.
1.00 – 3.96 mm pitch headers, wafer connectors, terminal housings and crimp contacts.
VM-CN-0812
8536.69
8 – 15 days
20,000 pcs
Commercial terms are quoted for your specification, quantity, packaging and delivery terms. Send your requirement and we will respond in writing.
| Product | Wire-to-Board Connectors |
|---|---|
| Category | Electronics & Components |
| Pitch | 1.00 / 1.25 / 2.00 / 2.54 / 3.96 mm |
| Circuits | 2 – 24 positions |
| Current rating | 1 A – 8 A per contact |
| Insulator | PA66 UL94V-0, LCP high-temperature |
| Contact plating | Tin, gold flash, selective gold 0.4 µm |
| Mating cycles | 30 – 100 |
Indicative structure for Wire-to-Board Connectors. Quantities, documentation and scheduling are agreed in writing for your project; commercial terms are provided in a written quotation.
| Order type | Quantity | Documentation provided | Notes |
|---|---|---|---|
| Sample / trial | Below MOQ, by agreement | Sample invoice, test report, compliance declarations | Fastest route to evaluate fit, finish and function |
| Standard order | 20,000 pcs | Certificate of origin where applicable, inspection report on request | Indicative lead time: 8 – 15 days |
| Repeat / scheduled | 3 × MOQ or a release schedule | Same document set, held open for repeat releases | Buffer stock and scheduled shipments available |
| Contract supply | Annual volume with rolling forecast | Full document set per release, terms held for 12 months | Reserved capacity and quarterly review |
T/T 30 % deposit / 70 % before shipment, L/C at sight, or agreed milestones.
EXW, FOB Hong Kong / Shenzhen, CIF, DAP or DDP.
12 months against manufacturing defects unless otherwise agreed in writing.
Named account manager, complaint handling and replacement planning.
Send your quantity and destination and we will reply with pricing, lead time and shipping options within one business day.
Automotive-grade and industrial MCU, power-management and interface ICs in SOP, QFN, QFP and BGA packages.
2 – 12 layer rigid and rigid-flex boards with turnkey SMT assembly, AOI and functional test.
LoRaWAN, BLE 5 and Wi-Fi sensor nodes for temperature, humidity, current and vibration monitoring.
2.4 – 10.1 inch IPS TFT panels with capacitive or resistive touch and bonded cover glass.
Combine multiple products or suppliers into one consolidated shipment from Hong Kong and reduce freight and documentation cost.